Discover Non-Destructive 3D Inspection for SiC Pucks — Live at ICSCRM 2025
Scientific Visual, in collaboration with its partner PVA TePla, will present a breakthrough in SiC quality control at booth #55 during ICSCRM 2025 in Busan (September 14-19).
🔍 Key highlights
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3D internal defect visibility across the whole puck
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No destructive steps
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Automated material grading with tunable protocols
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Yield estimation including slicing & polishing costs
📍 Where to find us
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Booth #55 (PVA TePla) — live system demos
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Industrial Talk by COO Frédéric Falise on 15 Sept, 6:50 pm
📰 For a deeper dive, check the article:
What does the SiC Puck Scanner reveal? (≈ 5 min read)
It shows how puck-level defect maps line up with Raman/PL inspection of the produced wafers.
✨ Don’t miss your chance to see the scanner in action.
👉 Book your demo now or email welcome@scientificvisual.ch
Link: https://icscrm2025.org/